H. Bentz is a leader in the production and development of integrated circuits using Thin Film technology, adhering to the most stringent international standards. Our unique expertise focuses on developing Thin Film solutions for the defense, medical, and communications industries, combining technological innovation with economic efficiency.
Our advanced design and manufacturing capabilities allow for maximum design flexibility, tailored to the unique requirements of each project. We pride ourselves on our ability to provide cost-effective solutions that combine high quality with economic efficiency, without compromising on performance.
Our technology offers significant advantages, primarily exceptionally high density and precision. The widespread use of Thin Film technology in the semiconductor, photonics, and communications industries testifies to its efficiency and importance. We offer a wide range of substrates and metals, allowing us to tailor the perfect solution to the specific requirements of each client.
In terms of materials, we work with a wide variety of substrates, including 99.6% pure Alumina (AL2O3), in both As fired and polished versions. Additionally, we offer solutions based on Beryllium Oxide (BeO), Aluminum Nitride (AlN), and Fused Silica (SiO2). In the field of metals, we use copper, silver, gold, and platinum, enabling us to provide a wide range of electrical and physical properties.
Our team of experts, with rich experience in the field, is at your disposal for consultation and tailoring the perfect solution for your project needs. We accompany our clients throughout all stages of the project, from initial design to final production, ensuring uncompromising quality and precision.
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