H. Bentz is a leader in the production of ceramic substrates for Thick Film circuits, offering reliable and durable solutions for challenging applications. Our Thick Film technology is characterized by a range of significant advantages, enabling us to deliver high-quality products with excellent performance.
The notable advantages of Thick Film technology include high resistance to corrosion, heat, humidity, and shock, making it ideal for harsh working environments. The circuits we produce are exceptionally compact, with excellent adhesion to the substrate, ensuring long-term reliability. Additionally, the technology allows for direct printing of resistors on the substrate, increasing design flexibility and reducing the number of required components.
A significant advantage of our manufacturing process is the ability to rapidly produce both small and large quantities while maintaining an environmentally friendly process with minimal waste. This flexibility allows us to adapt production to the changing needs of our customers.
H. Bentz’s unique specialization lies in the production of multi-layer Aluminum Nitride (AlN) substrates, with the capability to produce up to 30 layers. Furthermore, we have developed a unique technology of Direct Bonded Copper (DBC) backside for heat dissipation with brazing, significantly improving circuit performance under extreme heat conditions.
Aluminum Nitride (AlN) is a key material in our technology, offering numerous benefits. It is characterized by high thermal conductivity and high structural strength, essential properties for demanding applications. Its low Coefficient of Thermal Expansion (CTE) makes it ideal for bonding silicon components. Importantly, AlN serves as a non-toxic alternative to Beryllium Oxide (BeO), enhancing the safety and environmental friendliness of our products.
Quality and professionalism are core values at H. Bentz. We manufacture all our products in clean rooms and to high standards, with rigorous quality control and compliance with the most stringent requirements. Our team of experts accompanies clients throughout the entire process, from the development stage to mass production, ensuring excellent results and complete satisfaction.
We work with a wide range of substrate materials, including 99.6% pure Asfired Alumina and Polished Alumina, Beryllium Oxide, Aluminum Nitride, and Fused Silica. Alongside this, we offer a selection of materials for application on the substrates, including copper, silver, gold, platinum, and silver-palladium, allowing us to tailor the perfect solution for every need.
Our team of experts is at your disposal for consultation and tailoring the perfect solution for your project needs. At H. Bentz, we are committed to providing the most advanced technology, along with professional and personalized service, to ensure the success of our clients’ projects.
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