H. Bentz is a leader in advanced assembly and wiring services using Chip & Wire Bonding technology. Our laboratory is equipped with state-of-the-art technology, enabling us to provide precise and reliable solutions for a wide range of applications. We specialize in bonding and soldering components on various ceramic substrates, including multi-layer Thick Film and Thin Film. Our capabilities also include the installation of passive components such as resistors and capacitors, as well as the integration of bare silicon components.
The electrical connections in our Chip & Wire process are made using advanced bonders, utilizing gold or aluminum wires. We offer flexibility in wire thickness selection, according to each client’s specific requirements. Upon completion of the process, the circuits are carefully packaged, fully adhering to customer requirements and meeting the highest reliability levels, tailored to the stringent standards of military, aviation, and space industries.
Our technology offers significant advantages, including high reliability, maximum component density, and miniature size. The flexibility of our technology allows us to cater to a wide array of applications, including substrate carriers, amplifiers, oscillators, sync converters, resistor networks, stabilizers, filters, lamps, sensors, and more. We take pride in our ability to provide solutions for diverse industries, including industrial, military, and medical applications.
Our expertise in advanced Chip & Wire technologies, coupled with our ability to tailor solutions to the unique requirements of each project, ensures excellent results. We maintain rigorous quality control throughout the entire production process and are committed to meeting the most stringent industry standards. Our team of experts is always available for consultation and tailoring the perfect Chip & Wire solution for your project needs.
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