קו ייצור שכבות עבות Thick Film

מצעים על גבי אלומינה ואלומניום אוקסיד

Multi-layer circuits

Asfired Alumina (AI203) 99.6%

Polished Alumina (AL203) 99.6%

Beryllium Oxide (BeO)

Aluminum Nitride (AIN)

Fused Silica (SiO2)

Copper ( Cu )

Silver ( Ag )

Gold ( Au )

Platinum ( Pt )

AlN PCB processed by thick film process (Silver/Silver Palladium metallization) as well as DBC (Direct Bond Copper)