BGA Rework #6000


 
Specifications:

   -PCB dimension: W20*D20~W450*W400mm 
   -PCB thickness: 0.5~4mm
   -Applicable chip size: 1×1~70×70mm
   -Placement precision: ±0.02mm
   -PCB locating way: outer or jig
   -Working table adjustment: ±10mm forward/backward, ±10mm left/right
   -Temperature control: K-type thermocouple, close cycle controlled
   -Preheater: far infrared: 3000W 
   -Top heater: hot air,1000W
   -Bottom heater: hot air, 1000W 
   -Power supply: single-phase 220V, 50/60Hz, 6KW
   -Air supply: 5~8kgf/cm2,60L/min
   -Machine dimension: L700*W660*H950
   -Max BGA weight: 300g

   -Weight: Appox 120Kgs

Features: 

   ●Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
   can store 200 groups of different BGA heating points and register marks;
   ●Color optical system with functions of split vision, zoom - in and micro-adjustment,equipped with aberration de
   -tection device; with auto focus and software operation function,22X optical focus;can rework BGA dimension up 
   to 70mm×70mm;
   ●Touch screen interface, PLC control; real-time profie display,able to display temperature curves and detecting cu
   -rves at the same time; 
   ●Color LCD monitor;
   ●Built-in vacuum pump, 60° rotation in Φ angle; mounting nozzle is micro-adjustable;
   ●8 segments of temperature up (down) and 8 segments constant temperature control, 200 groups of temperature
   curve are stored; Curve analysis can be carried out on the touch screen;
   ●Able to arrive at three independent temperature zones,temperature and time can be displayed digitally on the touch 
   screen;able to rework CGA;
   ●The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
   ●Suction nozzle can identify material and mounting height automatically, and can control the gas pressure within a 
   small range of 30g-50g;
   ●Heaters can be moved ina any location within the working area to fit for reworking BGA in different positions on PCB
   ●Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance,have spec-    ailfunction for save nitrogen to saving cost;
   ●Have the fuction for over-heating protection;
   ●Large IR area heater from the botton will heat the PCB evenly to avoid deformation and keep soldering effect, heating 
   borad is independent controlled;
   ●Epuipped with different alloy hot gasnozzles, easy to replace and able to locate in any angle;
   ●The integrative heating head, driven by step motor; can store 200 groups of different heating points and register marks.