SP360C BGA Rework Station


  Applicable PCB:
   -Max PCB size:430mmX350mm
   -Applicable BGA:
   -Max size:55mmX55mm
   -Min size:7mmX7mm
   -Max BGA weight:80g
   -Power for operation:4000W
   -Upper heater(hot air):800W
   -Lower heater(hot air):800W
   -Bottom IR heater:2400W
   -Machine Dimension:650*500*600mm
   -Machine Weight:36KG
   -Power supply: AC 220V 4KW

   ●Made of high quality heating material; desoldering and soldering procedures of
   BGA are precisely controlled;
   ●Movable heating head, which is able to move freely horizontally, easy to operated;
   ●Embedded industrial computer, PLC control, real-time profile display, able to
   display set profile and practically-tested profile; big size screen, easy to operate;
   ●Profile saving no limit in this industrial computer, can analyze the two
   practically-tested profiles, can input both English and Chinese;
   ●The temperatures of the upper and lower hot air heaters can be precisely controlled
   according to their specific temperatures. The infrared constant temperature heating
   zone at the bottom area and the appropriate temperature-control settings make the
   rework safer and more reliable.
   ●The supports for the BGA soldering supporting frame are micro-adjustable to
   restrain local sinkage.
   ●Powerful cross flow fans cool the lower heating area rapidly;
   ●The adjustable PCB positioning support, onto which the special fixtures for alloyed
   board could be installed, enables easy and fast positioning of the PCB board;
   ●Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for
   removing BGA;
   ●Both the upper and lower parts are equipped with over-temperature alarming and
   protection apparatus.
   ●With different alloy hot gas nozzles, easy to replace. It could be tailored as per the
   specific requirements.
   ●The integrated design of machine and chassis is room-saving. could be altered to
   ●The software can be updated to auto-profile in future by USB, no need to set profiles.