E6000 החלפת רכיבי BGA


 
Specifications:

-PCB dimension: W20*D20~W450*W400mm
-PCB thickness: 0.5~4mm
-Applicable chip size: 1×1~70×70mm
-Placement precision: ±0.02mm
-PCB locating way: outer or jig
-Working table adjustment: ±10mm forward/backward, ±10mm left/right
-Temperature control: K-type thermocouple, close cycle controlled
-Preheater: far infrared: 3000W
-Top heater: hot air,1000W
-Bottom heater: hot air, 1000W
-Power supply: single-phase 220V, 50/60Hz, 6KW
-Air supply: 5~8kgf/cm2,60L/min
-Machine dimension: L700*W660*H950
-Max BGA weight: 300g

-Weight: Appox 120Kgs

Features:

●Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function;
can store 200 groups of different BGA heating points and register marks;
●Color optical system with functions of split vision, zoom - in and micro-adjustment,equipped with aberration de
-tection device; with auto focus and software operation function,22X optical focus;can rework BGA dimension up
to 70mm×70mm;
●Touch screen interface, PLC control; real-time profie display,able to display temperature curves and detecting cu
-rves at the same time;
●Color LCD monitor;
●Built-in vacuum pump, 60° rotation in Φ angle; mounting nozzle is micro-adjustable;
●8 segments of temperature up (down) and 8 segments constant temperature control, 200 groups of temperature
curve are stored; Curve analysis can be carried out on the touch screen;
●Able to arrive at three independent temperature zones,temperature and time can be displayed digitally on the touch
screen;able to rework CGA;
●The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area;
●Suction nozzle can identify material and mounting height automatically, and can control the gas pressure within a
small range of 30g-50g;
●Heaters can be moved ina any location within the working area to fit for reworking BGA in different positions on PCB
●Finished the BGA rework process under the nitrogen save through remain the nitrogen joggle in advance,have spec- ailfunction for save nitrogen to saving cost;
●Have the fuction for over-heating protection;
●Large IR area heater from the botton will heat the PCB evenly to avoid deformation and keep soldering effect, heating
borad is independent controlled;
●Epuipped with different alloy hot gasnozzles, easy to replace and able to locate in any angle;
The integrative heating head, driven by step motor; can store 200 groups of different heating points and register marks.