עמדת תיקונים לרכיבי החדרה


TW-200
 
Features:
 
   ●Carry on selective light wave soldering to the partial through-hole device; able to rework fastenings,
   Big heat capacity components socket and multi-basepin components;
   ●Able to remove wide range of devices up to 180mm in length;
   ●Double laser instructions, simple and practicable;
   ●Temperature and motor speed are closed-loop controlled by the PLC; with fast temperature setting,
   temperature is continuously adjustable between upper limit and lower limit.
   ●Easy and efficient to remove components, PCB and componnets heated evenly;
   ●Simply and safe to operate, easy to maintain, nozzle easy to replace;
   ●Foot switch controls the wave soldering starting, tin-spraying height is continuously adjustable;
   ●Little dross, save tin solder

Specification:

   -Max. component size:180mm
   -PCB thickness:0.8-5mm,maximum 10mm
   -Workable PCB size:450mm×500mm
   -PCB stents lifting height:30mm
   -Tin pump running adjustable time:1-900sec.
   -Temperature Precision:±2℃
   -Heating temperature:260-350℃
   -Input Voltage:220V
   -Power:2.1Kw
   -Boundary dimension:460*460*360mm
   -Gross weight:80kgs
מודלTW-200