תיקון/החלפת BGA


B500C
Specifications:

   -PCB dimension: W50*D50~W500*D500mm 
   -PCB thinkness: 0.5~3mm 
   -PCB locating way: Outer or Jig
   -Nozzle heat: 800W 
   -Bottom preheater: far infrared 3600W 
   -Machine dimension: L840×W680×H560mm
   -Temperatur control: K-type thermocoupleclose cycle controlled
   -Lower hot-air heater: 800W 
   -Power supply: single-phase, 220V,50/60Hz
   -Weight: Appox 55kgs
Features:

   ●Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;
   ●Air flow and temperatures are adjustable in a wide range to produce high temperature breeze;
   ●Movable heating head, easy to operate.
   ●Touch screen interface, PLC control, able to display temperature curves and detecting curves at the same time.
   ●Three independent heating areas, temperatures and time can be displayed digitally on the touch screen;
   ●8 segments of temperature up (down) and 8 segments constant temperature control, 50 groups of temperature -
   curves are stored;
   ●The height of bottom heating nozzle is miro-adjustable;
   ●The whole preheating zone can moved horizontally, so as to be suitable for more types of BGA and PCB of bigger 
   size.
   
מודלB500C