מכונת תיקון/החלפת רכיבי BGA


E500A
 
Specifications:
   -PCB dimension: W20*D20~W600*D500mm 
   -PCB thickness: 0.5~4mm
   -Placement precision: ±0.02mm
   -Working table adjustment: ±10mm forward/backward, ±10mm left/right
   -Temperature control: K-type thermocouple, close loop controlled 
   -PCB locating way: Outer or jig
   -Preheater: far infrared, 6000W 
   -Upper heater: hot air, 1000W
   -Lower heater: hot air, 1000W 
   -Power supply: single-phase 380V, 50/60Hz, 10KW
   -Machine dimension: L1350*W800*H1800mm
   -Air supply: 5~8kgf/cm, 8L/min 
   -Weight: Appox. 180kg
   Features: 
   ●Hot air head and mounting head are designed 2 in 1, and, can store 5,0000 groups of working locations, 
   with the function of auto soldering and mounting;
   ●Driven by X and Y axes step motor, operated with rocker bar , micro-movable when approaching the destination; 
   able to store unlimited data; able to automatically suck BGA for soldering; after that, automatically place BGA to 
   designated location;
   ●Color optical system with functions of split vision, zoom-in and micro-adjustment, equipped with abbreviation 
   detection    device, auto focus, software operation, 30X optical focus, able to rework BGA sized up to 70mm×70mm;
   ● Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve display, able to 
   display set curves and 9 detecting curves at the same time;
   ●Color LCD monitor;
   ●Suction nozzle can identify automatically material and mounting height, can constrain the pressure within a small 
   range of 30~50g;
   ●Connected with nitrogen outside for nitrogen-protected soldering and desoldering;
   ●Build-in vacuum pump, 360° rotation in Φ angle; mounting nozzle is micro-adjustable;
   ●The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area;
   ●8 segments of temperature up (down) and 8 segments constant temperature control, 5,0000 groups of temperature 
   curve  are stored, connected with computer, unlimited storage of curves; curve analysis can be carried out on the 
   touch screen, comparing with the history saved curves; with computer communication function, communication software 
   is attached;
   ●Three independent heating areas, temperature and time can be displayed digitally on the touch screen, can rework CGA;
   ●Both upper and lower hot-air heating heads are movable on the IR preheating area to fit for reworking BGA in 
   different    positions on PCB;
   ●Control independently through external computer, and finish all functions;
   ●Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keep soldering effect; 
   heating board is independently controlled;
   ●Equipped with different alloy hot air nozzles, easy to replace, be able to locate in any angle.
מודלE500A